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Vietnam and Japan Deepen Semiconductor Research Collaboration with Nafosted Funding Five Projects
Vietnam's National Fund for Science and Technology Development (Nafosted) announced funding for five joint research projects with Japan in the semiconductor sector. This signifies enhanced bilateral cooperation in strategic technology areas, including chip development for AI, IoT, and energy management.
The National Fund for Science and Technology Development (Nafosted) has decided to fund five joint research projects between Vietnam and Japan in the semiconductor sector, marking a significant step in bilateral scientific and technological cooperation. The announcement and signing ceremony, held on the afternoon of July 22, saw Nafosted finalize funding contracts for these research initiatives. The supported research spans from materials science and integrated circuit design to the development of chips for AI, the Internet of Things (IoT), and energy management – all areas considered core and strategic technologies that Vietnam is prioritizing for development. Dao Ngoc Chien, Director of Nafosted, stated that Japan is an ideal partner for Vietnam, citing its advanced scientific and technological foundation, extensive experience, and long-standing strengths in semiconductor materials, equipment, design, and supporting technologies. He emphasized that cooperation with Japan holds "special strategic importance." This event signifies a transition from bilateral cooperation to the implementation of joint research projects between Vietnam and Japan, offering domestic research teams opportunities to access new research directions, advanced equipment systems, and connect with international scientific networks. Director Chien urged the research teams to accurately execute their objectives and timelines, maintain regular and substantive coordination mechanisms with their Japanese counterparts, ensure scientific integrity and quality, utilize funds efficiently, and take responsibility for their registered outcomes. Beyond professional achievements, the collaboration also aims to foster the training of the next generation, including young scientists, PhD students, and talented engineers, thereby forming long-term links between universities and research institutes in both countries. Prof. Vu Van Truong from Phenikaa University, one of the five recipient institutions, commented that while the five projects pursue different research directions, they collectively form crucial links within the semiconductor value chain. "Each project has its own approach, but together they contribute to the overall picture of Vietnam's semiconductor research capabilities," he said. Mr. Ishikawa Isamu, Minister-Counselor at the Japanese Embassy in Vietnam, noted that there are currently 30 Vietnamese PhD students studying semiconductors in Japan. He revealed that Japan plans to host approximately 250 Vietnamese PhD and postgraduate students for semiconductor-related studies and research. Minister-Counselor Ishikawa highlighted that Japan is experiencing a new wave of investment in semiconductors, and there is growing interest in Vietnam's high-quality semiconductor workforce. "Vietnam's development is intertwined with Japan's, and Japan's development is also intertwined with Vietnam's," he stated, expressing his delight that Japan can cooperate with Vietnam in the semiconductor field. Semiconductors are among the ten strategic technology groups announced by the Vietnamese government in May. Within the list of 30 strategic technology products that Vietnam prioritizes for development, semiconductor chips are categorized as foundational for the future, driving new growth, and ensuring national security and defense autonomy. The five joint Vietnam-Japan research projects in the semiconductor field are: 1. Design, simulation, and fabrication of next-generation 3D stacked CFET integrated circuits using Si thin-film transistors. 2. Development of advanced semiconductor materials for high electron mobility transistors through a combination of theoretical simulation and experimentation. 3. Research and development of advanced semiconductor materials for integrated sensors and renewable energy devices. 4. Design of secure AI System-on-Chip (SoC) based on multi-core RISC-V CPUs and AI accelerators for AIoT devices. 5. Research and fabrication of power electronics materials and devices based on wide-bandgap semiconductors, applied to power management chips used in high-performance power devices. Source: VnExpress
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VnExpress